TR2013-036
Design of Enhancement Mode Single-gate and Double-gate Multi-channel GaN HEMT with Vertical Polarity Inversion Heterostructure
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- "Design of Enhancement Mode Single-gate and Double-gate Multi-channel GaN HEMT with Vertical Polarity Inversion Heterostructure", International Symposium on Power Semiconductor Devices and ICs (ISPSD), May 2013.BibTeX TR2013-036 PDF
- @inproceedings{Feng2013may,
- author = {Feng, P. and Teo, K.H. and Oishi, T. and Yamanaka, K. and Ma, R.},
- title = {Design of Enhancement Mode Single-gate and Double-gate Multi-channel GaN HEMT with Vertical Polarity Inversion Heterostructure},
- booktitle = {International Symposium on Power Semiconductor Devices and ICs (ISPSD)},
- year = 2013,
- month = may,
- url = {https://www.merl.com/publications/TR2013-036}
- }
,
- "Design of Enhancement Mode Single-gate and Double-gate Multi-channel GaN HEMT with Vertical Polarity Inversion Heterostructure", International Symposium on Power Semiconductor Devices and ICs (ISPSD), May 2013.
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Research Area:
Abstract:
We propose the design and simulation study of novel gallium nitride (GaN) devices, consisting of nitride stacks with different polarity, to provide multiple channels by flexible gate(s) control. Calibrated TCAD device simulations visualize device characteristics of 0.62-μm-gate-length multi-channel transistors. E-mode operations demonstrate a positive small threshold voltage Vth below 2 V at Vds = 0.1 V for all multichannel devices, and a high on-state current Ion (Vgs = Vds = 4 V) up to 4 A/mm achieved by 4 channels induced within the device.
Related News & Events
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NEWS ISPSD 2013: publication by Rui Ma, Koon Hoo Teo and others Date: May 26, 2013
Where: International Symposium on Power Semiconductor Devices and ICs (ISPSD)
Research Areas: Applied Physics, Electronic and Photonic DevicesBrief- The paper "Design of Enhancement Mode Single-gate and Double-gate Multi-channel GaN HEMT with Vertical Polarity Inversion Heterostructure" by Feng, P., Teo, K.H., Oishi, T., Yamanaka, K. and Ma, R. was presented at the International Symposium on Power Semiconductor Devices and ICs (ISPSD).